* On your first PCB Assembly order!
* Up to $300 discount
C - A L L E Y About Us | Events | Design Service | Testing Service | PCB Assembly | Products Services | Services & Focus
BGA (Ball Grid Array) assembly with X ray inspection.
Kingsheng has started build (Ball Grid Array) BGA assembly service experience since Year 2005 to present time. Over these many years experience with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA board.
Ball grid array(BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA unfilled die attachment technology will result in a smaller profile, lighter weight, thinner thickness, less interference, minimal signal delay, optimal electrical performance and improve its thermal property greatly. Therefore, BGA has been commonly used for its better assembly capability and high reliability.
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
+86 13828766801
kspcba@c-alley.com
https://www.kingshengpcba.com/
2/F, Building 6, Tangtou 3rd Industrial Zone, Tangtou Community, Shiyan Town, Baoan District, Shenzhen, China, 518108
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
